Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer

Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on 300 mm glass wafer using standard foundry process is reported. Established wafer-level packaging electroplated Cu with Au finish used to fabricate the electrodes directly substrate. A trap tested by loading it laser-cooled 88Sr+ ions. The shows stable operation RF amplitudes in range 100–250 V at 33 MHz frequency. lifetime order 30 min laser cooling vacuum chamber pressure ≈5 × 10−11 mbar. These results demonstrate potential large-size substrates realize scalable and integratable trapped ion-based quantum devices.